TDA3592 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

File under Integrated Circuits, IC02 January 1988

INTEGRATED CIRCUITS

TDA3592A

SECAM-PAL transcoder

January 1988 2

Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

GENERAL DESCRIPTION

The TDA3592A transcoder circuit converts SECAM input signals into true PAL signals, and can be used in combination

with all types of PAL decoder.

Features

•Limiter input for chrominance signal

•SECAM demodulator

•Clamp circuits and de-emphasis for colour difference

signals

•Modulator to provide true PAL signals

•4,43 MHz oscillator

•Sandcastle pulse detector

•Identification circuit for horizontal and vertical SECAM

identification

•Can be used with all types of PAL decoder

•Power-saving feature operates when supply voltage

falls to (typ.) 5 V:

SECAM processing shuts down but

SECAM signal path remains active

QUICK REFERENCE DATA

PACKAGE OUTLINE

24-lead DIL; plastic with heat spreader (SOT-101B); SOT101-1; 1996 November 25.

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage (pin 17) VP9,0 12,0 13,2 V

Supply current (pin 17) VP= 12 V IP65 90 115 mA

Supply current (pin 17 and 18)

(SECAM only) VP=5 V I

P16 20 24 mA

Chrominance ampliﬁer and demodulator

Input signal SECAM (pin 3)

(peak-to-peak value) V3-1(p-p) −−1100 mV

Input signal SECAM (pin 3)

(peak-to-peak value) V3-1(p-p) 15 100 300 mV

Output signal PAL (pin 9)

(peak-to-peak value) pin 3 = 280 kHz V9-1(p-p) −820 −mV

Identiﬁcation

Input voltage range for horizontal

identification (pin 4) V4-1 4,1 −VPV

Input voltage range for vertical

identification (pin 4) V4-1 0−2,9 V

Identiﬁcation at pin 6 V6-1 −10,6 −V

Slicing level reference voltage (pin 5) V5-1 −7,0 −V

Sandcastle pulse detector

Vertical blanking level V19-1 −1,5 −V

Horizontal blanking level V19-1 −3,5 −V

Burst gating level V19-1 −7,0 −V

Luminance ampliﬁer

Luminance input signal (peak-to-peak value) V16-1(p-p) −1,2 −V

Luminance ampliﬁer gain at 4,4 MHz G16-15 −7,0 −dB

January 1988 3

Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

Fig.1 Block diagram.

January 1988 4

Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

PINNING

FUNCTIONAL DESCRIPTION

Demodulation

The chrominance and identification demodulators of the TDA3592A both share the same reference tuned circuit (pins 23

and 24). The identification circuit automatically detects whether the incoming signal is SECAM or SECAM (NTSC, PAL

or black-and-white).

When the incoming signals are PAL they are diverted via pin 16 to the chrominance output at pin 14 and no signal

demodulation takes place. The delay line connected to pin 16 delays the signals to equalize the delay of the SECAM-PAL

transcoding process. When SECAM signals are received, the PAL signal path is switched off.

Incoming SECAM signals are applied to pin 3 via an external bell filter. The signals are amplified, limited and then

demodulated. Only one demodulator is necessary as the colour difference signals are available sequentially. After

demodulation the colour difference signals are separated by an H/2 switch and then applied to (R-Y) and (B-Y) clamp

circuits where the black levels are clamped to the same DC level. With all conditions at pin 4, artificial black levels are

inserted during the horizontal blanking periods. This is done because of the possibility of horizontal burst signals not

being available. The artificial levels may not be identical to the detected black level due to circuit spread but this can be

corrected by detuning the reference tuned circuit.

1. Ground.

2. Limiter feedback.

3. Limiter input: chrominance input SECAM; identiﬁcation input SECAM/SECAM.

4. Identiﬁcation selection input using a DC level to preset the identiﬁcation mode.

At V4< 2,9 V the TDA3592A is preset for frame identiﬁcation.

At V4> 4,1 V the TDA3592A is preset for line identiﬁcation.

5. Storage capacitor input for ﬂoating level identiﬁcation.

6. Storage capacitor input to SECAM/SECAM identiﬁcation circuit.

7. Double time-constant input to SECAM/SECAM identiﬁcation circuit.

8. 4,43 MHz oscillator.

9. Sequentially modulated output.

10. Decoupling capacitor for miller integrator feedback circuit.

11. Direct input chrominance signal.

12. Delayed input chrominance signal.

13. PAL/PAL input signal from PAL decoder.

14. Chrominance output signal.

15. Luminance output signal.

16. Luminance/SECAM input signal.

17. Positive supply voltage (Vp).

18. Decoupled positive supply voltage.

19. Three-level sandcastle pulse input.

20. De-emphasis circuit connection: R = 560 Ω; C = 1 nF.

21. Storage capacitor connection for (R−Y) clamp.

22. Storage capacitor connection for (B−Y) clamp.

23. Demodulator reference tuned circuit: nominal frequency = 4,33 MHz; nominal QL= 2,45.

24. As for pin 23.

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Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

The two colour difference signals are combined again after clamping and then applied to the modulator via de-emphasis,

blanking and reinsertion circuits. The ratio of (R-Y) to (B-Y) at the de-emphasis output (pin 20) is 1,78.

Modulation

A burst signal is reinserted into the combined SECAM signal at the input to the PAL modulator. At this input the phase

relationship for magenta colour is +(R-Y) and −(B-Y). The modulation carriers for the (R-Y) and (B-Y) signals are 90° out

of phase; for a magenta colour the modulated (R-Y) component has the same phase position as the (R-Y) burst. The

(B-Y) burst is modulated 180°out of phase with respect to the (B-Y) component of a magenta-coloured input signal.

Identiﬁcation SECAM/SECAM

Identification of the SECAM signal is performed using the fact that only SECAM signals have a line-to-line difference in

voltage level. The identification circuit compares the phase of the demodulated voltage difference waveform with the

phase of the flip-flop output. If the phase relationship is not correct, the flip-flop is reset by an extra pulse from the flip-flop

trigger generator. For horizontal identification the phase comparison is performed during the period of pulse ‘B’ (see

Fig.2). When vertical identification is selected, the comparison is performed only during the horizontal scan of the vertical

blanking. The SECAM identification circuits operate when selected by the voltage on pin 4; this may be horizontal, vertical

or combined horizontal and vertical identification, depending on the switching arrangements of pin 4.

These are as follows:

•Horizontal identification preset when V4-1 <2,9 V;

•Vertical identification preset when V4-1 > 4,1 V;

•Horizontal/vertical combination when sandcastle pulse is present on pin 4.

Information obtained from the identification detector is also used for colour killing and, if required, for switching to PAL.

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Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

Sandcastle pulse detection

The sandcastle pulse detector requires a three-level sandcastle pulse to provide horizontal blanking, vertical blanking

and burst gate pulses. The detector burst gate pulse triggers a pulse generator which produces two timing pulses, pulse

‘A’ and pulse ‘B’ (see Fig.2). Pulse ‘A’ is used to time the PAL modulator burst and to sample the (R-Y) and (B-Y)

clamping pulse generators. A (R-Y) clamping pulse is generated only during a red line and a (B-Y) clamping pulse only

during a blue line. Pulse ‘B’ times the SECAM horizontal identification.

Carrier generation

The carrier signal for the PAL modulator is obtained from a 4,43 MHz oscillator. An internal Miller integrator operates in

conjunction with the decoupling capacitor at pin 10 to provide the required 90° phase shift.

PAL matrix

The signal output from the PAL modulator at pin 9 is sequentially modulated with (R-Y) burst phased in the +(R-Y)

direction, and (B-Y) burst phased in the −(B-Y) direction. This PAL signal is applied directly to pin 11 and via a 64 µs

delay to pin 12. A true PAL signal is constructed in the PAL matrix by means of an additional/substraction process (in a

correct H/2 sequence) using the delayed and undelayed inputs.

Fig.2 Burst gate timing pulse generation.

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Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

Coupling of identiﬁcation systems

Coupling of a TDA3592A and a PAL decoder can be performed to obtain an optimum identification system. The system

operates using the functions of pins 13, 6 and 7: the voltage level at pin 13 is controlled by the PAL/PAL detection of the

PAL decoder; and the voltage level at pins 6 and 7 are functions of SECAM/SECAM detection in the TDA3592A.

The circuit action is as follows and is summarized in Table 1.

Table 1 System operating modes

System priorities

When TDA3592A pin 13 is connected to the PAL/PAL output of a PAL decoder, the system will give PAL priority in signal

identification. Connecting TDA3592A pin 13 to ground will give SECAM priority.

Luminance and chrominance signal paths

The signal input at pin 16 is clamped by a circuit which detects the top of the luminance signal sync pulse. This clamp,

the luminance signal path to pin 15 and the SECAM signal path to pin 14 remain active when the supply voltage falls to

(typ.) 5 V. At this level of supply voltage the SECAM processing circuits are switched off, giving a reduction in total power

dissipation.

Channel switching During channel switching pin 6 is taken rapidly to a high voltage (±10,2 V), this corresponds

to the SECAM mode of the TDA3592A.

PAL The high voltage level at pin 6 caused by channel switching is maintained by the TDA3592A

when it recognizes the signal as SECAM (this condition is maintained even if reﬂected PAL

signals are present). The PAL decoder recognizes the signal as PAL and takes pin 13 of

TDA3592A to a voltage greater than 1,7 V. The TDA3592A is now held in the SECAM

condition by an internal current source at pin 6.

SECAM The initial high voltage level (+ 10,2 V) at pin 6 caused by channel switching sets the

TDA3592A in the SECAM mode and during this time the PAL decoder detects a PAL signal.

This causes a voltage at pin 13 of < 1,1 V which prevents the internal current source of

TDA3592A maintaining the high voltage level of pin 6 which, in turn, allows the TDA3592A to

detect SECAM. The initiation of SECAM detection is delayed by the action of the external

circuit at pins 6 and 7 and commences as pin 6 approaches 7,0 V. The SECAM signals are

converted by TDA3592A to PAL signals at pin 14, which results in the PAL decoder switching

to the PAL mode (the TDA3592A remains in the SECAM mode).

Black-and-white The TDA3592A is initially set in the SECAM mode as previously described. The PAL decoder

detects PAL and the TDA3592A detects SECAM which results in a system operation in the

colour-killing mode.

TDA3592A PAL DECODER MODE SYSTEM OPERATING MODE

SECAM PAL SECAM

SECAM PAL condition not used

SECAM PAL PAL

SECAM PAL black-and-white

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Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

CHARACTERISTICS

VP=V

17−1= 12 V; Tamb =25°C; unless otherwise speciﬁed.

The parameter values are valid only when the reference tuned circuit has been aligned as detailed in note 1. All

voltages are reference to ground pin 1.

PARAMETER SYMBOL MIN. MAX. UNIT

Supply voltage (pin 17) VP−13,2 V

Total power dissipation Ptot −1,78 W

Operating ambient temperature range Tamb −25 +70 °C

Storage temperature range Tstg −25 +150 °C

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supplies

Supply voltage (pin 17) V17 9,0 12 13,2 V

Supply current (pin 17) I17 65 90 115 mA

Supply current (pin 18) I18 40 −160 µA

Decoupled supply voltage (pin 18) Rext17−18 =2 kΩV

18 8,8 11,8 13,2 V

External capacitance (pin 18) C18 −− 10 µF

Total power dissipation Ptot −1,08 1,38 W

Thermal resistance,

junction to ambient Rth j-a −40 45 K/W

Chrominance ampliﬁer and

demodulator

Input signal SECAM

(peak-to-peak value) V3(p-p) −− 1100 mV

Input signal SECAM at which

correct limiting occurs

(peak-to-peak value) V3(p-p) 15 100 300 mV

Input resistance (pin 3) R39,6 12,1 14,6 kΩ

Input capacitance (pin 3) C3−− 5pF

Input resistance between

pins 23 and 24 R23−24 2,9 3,6 4,3 kΩ

Input capacitance between

pins 23 and 24 C23−24 −12 −pF

De-emphasis output resistance

(pin 20) R20 0,9 1,1 1,3 kΩ

Chrominance demodulator

zero point stability (pin 20) note 2 f0−5−kHz

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Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

Linearity of (B-Y) demodulation

(pin 20) note 3 −−94 −%

Linearity of (R-Y) demodulation

(pin 20) note 4 −−100 −%

(R-Y)/(B-Y) ratio (pin 20) −−1,78 −%

Relative deviation of reinserted

black level/demodulated black

level (pin 20) as a function of

temperature

(R-Y) signals note 5 −−0,22 −kHz/°C

(B-Y) signals note 5 −−0,22 −kHz/°C

Identiﬁcation SECAM/SECAM note 6

Input voltage for line

identification (pin 4) V44,1 −VPV

Input voltage for frame

identification (pin 4) V40−2,9 V

Switching level for line/frame

identification (pin 4) V43,0 3,5 4,0 V

Input current (pin 4) −I4−525µA

Voltage at pin 6 during

SECAM/PAL V6−10,2 −V

Voltage at pin 6 during

SECAM/PAL V6−11,5 −V

Voltage at pin 6 during SECAM V6−7,0 −V

Identiﬁcation at pin 6 V6−10,6 −V

Colour OFF for SECAM V69,8 10,1 10,4 V

Colour ON for SECAM V68,8 9,1 9,4 V

Slicing level reference voltage

(pin 5) V5−8,4 −V

Sandcastle pulse detector and

clamping pulse generator

Voltage level at which the

vertical blanking pulse is

separated V19 1,0 1,5 2,0 V

Voltage level at which the

horizontal blanking pulse is

separated V19 3,0 3,5 4,0 V

Voltage level at which the burst

gating pulse is separated V19 6,5 7,0 7,5 V

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

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Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

Input current V19 =0V −I

19 −30 100 µA

Width of pulse ‘A’ (Fig.2) note 7 1,85 2,35 2,85 µA

Required width of pulse ‘B’

(Fig.2) note 7 0,6 −−µs

Luminance ampliﬁer

Input signal (peak-to-peak value)

(pin 16) V16(p-p) −1,2 1,7 V

Gain (pin 16 to 15) f16 = 4,4 MHz G16−15 6,5 7,5 8,5 dB

Input current (pin 16) I16 −1,0 5,0 µA

Output impedance (pin 15) Z15 −20 −Ω

Frequency response at −3 dB

(pin 15 and 16) f 6,0 −−MHz

Gain (pin 16 to 14) f16 = 4,4 MHz G16−14 6,0 7,0 8,0 dB

Frequency response at −3 dB

(pin 14 and 16) f 6,0 −−MHz

External load resistance (pin 15) RL2,0 −−kΩ

Limiter, chrominance

demodulator and PAL

modulator note 8

Output resistance (pin 9) R9−25 −Ω

DC output voltage during

horizontal blanking (pin 9) V9−9,6 −V

Internal biasing resistor for

emitter follower (pin 9) −9,0 −kΩ

External load resistance (pin 9) RL(9) 2−−kΩ

Output signal (pin 9) when input

to pin 3 has a ∆f of 280 kHz;

without external load

(peak-to-peak value) V9(p-p) −0,82 −mV

(R-Y)/(B-Y) ratio (pin 9) 1,50 1,78 2,11

Chrominance/burst ratio for

SECAM (pin 9) 2,5 3,0 3,5

Linearity of (B-Y) signal (pin 9) note 3 85 92 99 %

Linearity of (R-Y) signal (pin 9) note 4 93 100 107 %

Black level shift as a function of

temperature (pin 9)

(R-Y) signals note 9 −0,22 −kHz/°C

(B-Y) signals note 9 −0,22 −kHz/°C

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

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Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

Phase relationship of modulated

(R-Y) burst to modulated

(B-Y) burst (pin 9) 87 90 93 deg

Amplitude relationship of

modulated (R-Y) burst to

modulated (B-Y) burst (pin 9) −1,5 0 +1,5 dB

Black level shift as a function of

supply voltage (pin 9)

(R-Y) signal −−1,5 −kHz/V

(B-Y) signal −1,0 −kHz/V

Oscillator

Oscillator frequency (pin 9)

(set with series capacitor) fOSC −4,433619 −MHz

Frequency deviation without

spread of external components

(pin 9) ∆fOSC −− ±150 Hz

Temperature coefﬁcient of

oscillator frequency (pin 9) −−2−3 Hz/°C

Frequency deviation for change

of VP from 9,0 to 13,2 V ∆fOSC −− 150 Hz

DC voltage (pin 8) V8−4,7 −V

Input resistance (pin 8) R8−1−kΩ

DC voltage (pin 10) V10 −4,4 −V

Input resistance (pin 10) R10 −2−kΩ

PAL matrix

Input resistance (pin 11) R11 700 900 1100 Ω

Input resistance (pin 12) R12 700 900 1100 Ω

Output resistance (pin 14)

(SECAM/SECAM) R14 −40 −Ω

Internal emitter follower load

resistance (pin 14) RINT(14) −7−kΩ

External load resistor (pin 14) RL(14) 2,4 −−kΩ

DC voltage (pin 11) V11 −5,0 −V

DC voltage (pin 12) V12 −5,0 −V

DC voltage (pin 14) SECAM mode V14 −6,2 −V

DC voltage (pin 14) SECAM mode

and

line blanking V14 −4,9 −V

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

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Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

H/2 ripple on chrominance

output (pin 14)

(peak-to-peak value) SECAM mode V14(p-p) −− 100 mV

Gain A; pin 11 to 14 GA910 11dB

Gain B; pin 12 to 14

((R-Y) at pin 9) GB910 11dB

Gain C; pin 12 to 14

((B-Y) at pin 9) GC910 11dB

Gain A −gain B GA−GB−0,7 −+0,7 dB

Gain A −gain C GA−GC−0,7 −+0,7 dB

Gain B −gain C GB−GC−0,7 −+0,7 dB

Phase A; pins 11, 14 to

pins 12, 14 ((R-Y) at pin 9) −181,5 −deg

Phase B; pins 11, 14 to

pins 12, 14 ((B-Y) at pin 9) −1,5 −deg

Phase A −phase B 178 180 182 deg

Identiﬁcation PAL/PAL

Input condition for PAL (pin 13) V13 1,7 −VPV

Input condition for PAL (pin 13) V13 −− 1,1 V

Input current V13 =6 V I

13 −− 10 µA

Input resistance V13 = 8,2 V R13 7,5 11,5 15,5 kΩ

Pin 6 internal current in

PAL/SECAM mode −I60,24 0,4 0,58 mA

Switching level PAL/PAL

(pin 13) V13 1,2 1,4 1,6 V

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

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Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

CHARACTERISTICS AT LOW SUPPLY VOLTAGE

VP=V

17−1= 5 V; Tamb =25°C; unless otherwise speciﬁed

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supplies

Supply current I17+I18 16 20 24 mA

Supply voltage switching level for

preset SECAM signal path SECAM processing

OFF V17−16,5 7,5 8,2 V

Luminance ampliﬁer

Input signal (peak-to-peak value) V16(p-p) −0,45 0,56 V

Gain (pin 16 to 15) f16 = 4,4 MHz G16−15 6,0 7,0 8,0 dB

Input current (pin 16) I16 −1,0 5,0 µA

Output impedance (pin 15) |Z15−1|−20 −Ω

Minimum load resistance (pin 15) RL2−−kΩ

Frequency response at −3 dB

(pin 16 to 15) f 6,0 −−MHz

Gain (pin 16 to 14) f16 = 4,4 MHz G16−14 5,7 6,8 7,9 dB

Frequency response at −3 dB

(pin 16 to 14) f 6 −−MHz

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Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

Notes to the characteristics

1. The parameter values given in the characteristics are valid only when the following alignment procedure is

performed:

a) Supply a SECAM signal input to pin 3 at 100 mV (peak-to-peak value) without deviation during a red and blue

line (SECAM black colour information).

b) Align the reference tuned circuit so that the output signal from pin 14 to the PAL decoder is minimum during scan

(PAL black colour information).

2. When the input signal to the limiter (pin 3) changes from 300 to 15 mV (peak-to-peak value) the zero point of the

chrominance demodulator shifts by a typical value of 5 kHz; f = 4,33 MHz (typ.).

3. (B-Y) linearity is defined by Vout(yellow)/Vout(blue) where fyellow = (typ.) 4,02 MHz; fblue = (typ.) 4,48 MHz.

4. (R-Y) linearity is defined by Vout(cyan)/Vout(red) where fcyan = (typ.) 4,68 MHz; fred = (typ.) 4,12 MHz.

5. The parameter value is equated by:

Where

A = demodulated black level at temperature X

B = demodulated black level at temperature Y

C = artificial black level at temperature X

D = artificial black level at temperature Y

E1 = demodulated output signal at temperature X (fo−∆f)

E2 = demodulated output signal at temperature X (fo+∆f)

F1 = demodulated output signal at temperature Y (fo−∆f)

F2 = demodulated output signal at temperature Y (fo+ ∆f)

for B-Y: fo= fob = 4,25 MHz (∆f = 230 kHz)

for R-Y: fo= for = 4,40625 MHz (∆f = 280 kHz)

6. During stable signal conditions V7 is always at VF(BAT85) below V6.

7. The burst gate pulse width >3,45 µs.

8. The specification figures are only valid when the reference tuned circuit is aligned as indicated in note 1.

9. Ensure that the 4,433 MHz carrier is in the correct phase; black level shift at temperature X = A and at Y = B.

Output signal (∆f = 230 kHz for B-Y; ∆f = 280 kHz for R-Y) at temperature X = E and at Y = F.

10. Chrominance definition −burst ratio at SECAM condition (pin 9).

BD–()FA(C)E⁄––⁄

YX–

------------------------------------------------------------------ f kHz()∆

°C

-----------------------

EE1 E2–

---------------------

=FF1 F2–

--------------------

The parameter is equated by: BFB–()⁄[]AEA–()⁄[]–

YX–

----------------------------------------------------------------------------- 230; 280 kH

The parameter is equated by:Vout p p–()

Red R Y–()

burst p p–()

RY–()

------------------------------------------------------------ .

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Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

APPLICATION INFORMATION

Fig.3 Application circuit.

(1) V4−1= sandcastle = line +frame identification

V4−1= ground = frame identification

V4−1= VP= line identification

(2) minimum load resistance at pin 15 = 2 kΩ

January 1988 16

Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

PACKAGE OUTLINE

UNIT A

max. 1 2 b1cD E e M

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT101-1 92-11-17

95-01-23

min. A

max. bw

1.7

1.3 0.53

0.38 0.32

0.23 32.0

31.4 14.1

13.7 3.9

3.4 0.252.54 15.24 15.80

15.24 17.15

15.90 2.25.1 0.51 4.0

0.066

0.051 0.021

0.015 0.013

0.009 1.26

1.24 0.56

0.54 0.15

0.13 0.010.10 0.60 0.62

0.60 0.68

0.63 0.0870.20 0.020 0.16

051G02 MO-015AD

(e )

seating plane

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

(1)

(1)(1)

DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1

January 1988 17

Philips Semiconductors Product speciﬁcation

SECAM-PAL transcoder TDA3592A

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“IC Package Databook”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.