Freescale Semiconductor Technical Data MPX5050 Rev. 7, 10/2004 Integrated Silicon Pressure Sensor On- Chip Signal Conditioned, Temperature Compensated and Calibrated The MPX5050/MPXV5050G series piezoresistive transducer is a state--of--the--art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin--film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. MPX5050 MPXV5050G SERIES Freescale Semiconductor Preferred Device INTEGRATED PRESSURE SENSOR 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 Volts Output Features UNIBODY PACKAGE * 2.5% Maximum Error over 0 to 85C * Ideally suited for Microprocessor or Microcontroller--Based Systems * Temperature Compensated Over -- 40 to +125C * Patented Silicon Shear Stress Strain Gauge * Durable Epoxy Unibody Element MPX5050D CASE 867 SMALL OUTLINE PACKAGE SURFACE MOUNT * Easy--to--Use Chip Carrier Option VS THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 SENSING ELEMENT GND GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY MPXV5050GP CASE 1369 Vout MPX5050GP CASE 867B PINS 4, 5, AND 6 ARE NO CONNECTS FOR UNIBODY DEVICE PINS 1, 5, 6, 7, AND 8 ARE NO CONNECTS FOR SMALL OUTLINE PACKAGE DEVICE Figure 1. Fully Integrated Pressure Sensor Schematic MPXV5050DP CASE 1351 MPX5050DP CASE 867C PIN NUMBER 1 N/C 5 N/C 2 VS 6 N/C 3 Gnd 7 N/C 4 Vout 8 N/C NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. (c) Freescale Semiconductor, Inc., 2004. All rights reserved. Sensor Device Data Freescale Semiconductor PIN NUMBER 1 Vout 4 N/C 2 Gnd 5 N/C 3 VS 6 N/C NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. MPX5050 MPXV5050G SERIES 1 MAXIMUM RATINGS(NOTE) Parametrics Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 200 kPa Storage Temperature Tstg --40 to +125 C Operating Temperature TA --40 to +125 C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Pressure Supply Symbol Min Typ Max Unit POP 0 -- 50 kPa VS 4.75 5.0 5.25 Vdc Io -- 7.0 10.0 mAdc Range(1) Voltage(2) Supply Current Minimum Pressure Offset(3) @ VS = 5.0 Volts (0 to 85C) Voff 0.088 0.20 0.313 Vdc Full Scale Output(4) @ VS = 5.0 Volts (0 to 85C) VFSO 4.587 4.70 4.813 Vdc Full Scale Span(5) @ VS = 5.0 Volts (0 to 85C) VFSS -- 4.50 -- Vdc Accuracy(6) -- -- -- 2.5 %VFSS Sensitivity V/P -- 90 -- mV/kPa tR -- 1.0 -- ms Io+ -- 0.1 -- mAdc -- -- 20 -- ms -- -- 0.5 -- %VFSS Response Time(7) Output Source Current at Full Scale Output Warm--Up Offset Time(8) Stability(9) NOTES: 1. 1.0kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm--up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 grams Weight, Basic Element (Case 1369) 1.5 grams MPX5050 MPXV5050G SERIES 2 Sensor Device Data Freescale Semiconductor Figure 3 illustrates the Differential/Gauge Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5050/MPXV5050G series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long--term reliability. Contact the factory for information regarding media compatibility in your application. Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. OUTPUT (V) 5.0 TRANSFER FUNCTION: 4.5 Vout = VS*(0.018*P+0.04) ERROR 4.0 VS = 5.0 Vdc TEMP = 0 to 85C 3.5 3.0 TYPICAL 2.5 2.0 1.5 MIN MAX 1.0 0.5 0 0 5 10 15 35 40 20 25 30 DIFFERENTIAL PRESSURE (kPa) 45 50 55 Figure 2. Output versus Pressure Differential +5 V FLUORO SILICONE GEL DIE COAT DIE P1 STAINLESS STEEL METAL COVER WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT Vout EPOXY PLASTIC CASE DIE BOND OUTPUT Vs IPS 1.0 mF 0.01 mF GND 470 pF P2 Figure 3. Cross--Sectional Diagram (Not to Scale) Figure 4. Recommended power supply decoupling and output filtering. For additional output filtering, please refer to Application Note AN1646. MPX5050 MPXV5050G SERIES Sensor Device Data Freescale Semiconductor 3 Transfer Function Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04) +/-- (Pressure Error x Temp. Factor x 0.018 x VS) VS = 5.0 V 0.25 Vdc Temperature Error Band MPX5050/MPXV5050G Series 4.0 Temp 3.0 Temperature Error Factor Multiplier -- 40 0 to 85 +125 2.0 3 1 3 1.0 0.0 --40 --20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 to --40C and from 85 to 125C. Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 --1.0 0 10 20 30 40 50 60 Pressure (in kPa) -- 2.0 -- 3.0 Pressure Error (Max) 0 to 50 kPa 1.25 kPa MPX5050 MPXV5050G SERIES 4 Sensor Device Data Freescale Semiconductor PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION TABLE to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Freescale Semiconductor MPX pressure sensor is designed Part Number Pressure (P1) Side Identifier Case Type MPX5050D 867 Stainless Steel Cap MPX5050DP 867C Side with Part Marking MPX5050GP 867B Side with Port Attached MPXV5050GP 1369 Side with Port Attached MPXV5050DP 1351 Side with Part Marking ORDERING INFORMATION -- UNIBODY PACKAGE (MPX5050 SERIES) MPX Series Device Type Options Order Number Case Type Device Marking Basic Element Differential 867 MPX5050D MPX5050D Ported Elements Differential Dual Ports 867C MPX5050DP MPX5050DP Gauge 867B MPX5050GP MPX5050GP ORDERING INFORMATION -- SMALL OUTLINE PACKAGE (MPXV5050G SERIES) Device Type Ported Elements Options Case No. MPX Series Order No. Packing Options Marking Side Port 1369 MPXV5050GP Trays MPXV5050G Dual Port 1351 MPXV5050DP Trays MPXV5050G MPX5050 MPXV5050G SERIES Sensor Device Data Freescale Semiconductor 5 PACKAGE DIMENSIONS UNIBODY PACKAGE C R M B NOTES: 10. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 11. CONTROLLING DIMENSION: INCH. 12. DIMENSION --A-- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). POSITIVE PRESSURE (P1) --A-N PIN 1 SEATING PLANE J S 1 2 3 4 5 6 --T-G F D 6 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. 5. 6. DIM A B C D F G J L M N R S L STYLE 2: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX M T A M STYLE 3: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND --VOUT VSUPPLY +VOUT OPEN INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30_NOM 0.475 0.495 0.430 0.450 0.090 0.105 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30_NOM 12.07 12.57 10.92 11.43 2.29 2.66 OPEN GROUND +VOUT +VSUPPLY --VOUT OPEN CASE 867--08 ISSUE N BASIC ELEMENT T NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. A U L SEATING PLANE R V DIM A B C D F G J K L N P Q R S U V Q N Q B 1 P J 0.25 M T Q 3 4 5 6 K S PIN 1 P C 2 M G F D 0.173 6X M T P S Q CASE 867B--04 ISSUE F S MILLIMETERS MIN MAX 29.08 29.85 17.4 18.16 7.75 8.26 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.1 23.11 BSC 4.62 4.93 STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX PRESSURE SIDE PORTED (AP, GP) MPX5050 MPXV5050G SERIES 6 Sensor Device Data Freescale Semiconductor PACKAGE DIMENSIONS--CONTINUED UNIBODY PACKAGE P 0.25 (0.010) M T Q --A-- M U W X R PORT #1 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. L V PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) N --Q-- PORT #2 VACUUM (P2) B PIN 1 1 2 3 4 5 K 6 C SEATING PLANE --T-- --T-J S SEATING PLANE D 6 PL G F 0.13 (0.005) M A M CASE 867C--05 ISSUE F DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06 VOUT GROUND VCC V1 V2 VEX PRESSURE AND VACUUM SIDES PORTED (DP) MPX5050 MPXV5050G SERIES Sensor Device Data Freescale Semiconductor 7 SMALL OUTLINE PACKAGE DIMENSIONS SURFACE MOUNT 2 PLACES 4 TIPS 0.008 (0.20) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) D L A1 DETAIL G 8 1 b 0.004 (0.1) NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M--1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. 8X F M C A B E1 B N T K A P 8X M 0.004 (0.1) DETAIL G C SEATING PLANE DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.300 0.330 0.002 0.010 0.038 0.042 0.465 0.485 0.717 BSC 0.465 0.485 0.100 BSC 0.245 0.255 0.120 0.130 0.061 0.071 0.270 0.290 0.080 0.090 0.009 0.011 0.115 0.125 0 7 MILLIMETERS MIN MAX 7.11 7.62 0.05 0.25 0.96 1.07 11.81 12.32 18.21 BSC 11.81 12.32 2.54 BSC 6.22 6.47 3.05 3.30 1.55 1.80 6.86 7.36 2.03 2.28 0.23 0.28 2.92 3.17 0 7 CASE 1369--01 ISSUE O MPX5050 MPXV5050G SERIES 8 Sensor Device Data Freescale Semiconductor SMALL OUTLINE PACKAGE DIMENSIONS -- CONTINUED SURFACE MOUNT 2 PLACES 4 TIPS 0.006 (0.15) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) D L A1 DETAIL G 8 1 b 0.004 (0.1) 8X F M C A B E1 B N STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. GND +Vout Vs --Vout N/C N/C N/C N/C T M A P 8X 0.004 (0.1) DETAIL G C SEATING PLANE K STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. N/C Vs GND Vout N/C N/C N/C N/C NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M--1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.370 0.390 0.002 0.010 0.038 0.042 0.465 0.485 0.680 0.700 0.465 0.485 0.100 BSC 0.240 0.260 0.115 0.135 0.040 0.060 0.270 0.290 0.160 0.180 0.009 0.011 0.110 0.130 0 7 MILLIMETERS MIN MAX 9.39 9.91 0.05 0.25 0.96 1.07 11.81 12.32 17.27 17.78 11.81 12.32 2.54 BSC 6.10 6.60 2.92 3.43 1.02 1.52 6.86 7.37 4.06 4.57 0.23 0.28 2.79 3.30 0 7 CASE 1351--01 ISSUE O MPX5050 MPXV5050G SERIES Sensor Device Data Freescale Semiconductor 9 NOTES MPX5050 MPXV5050G SERIES 10 Sensor Device Data Freescale Semiconductor NOTES MPX5050 MPXV5050G SERIES Sensor Device Data Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com E--mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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