MPX5050 MPXV5050G SERIES
1
Sensor Device Data
Freescale Semiconductor
Integrated Silicon Pressure Sensor
On- Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The MPX5050/MPXV5050G series piezoresistive transducer is a state--of--the--art
monolithic silicon pressure sensor designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs. This
patented, single element transducer combines advanced micromachining techniques,
thin--film metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
Features
!2.5% Maximum Error over 0"to 85"C
!Ideally suited for Microprocessor or Microcontroller--Based Systems
!Temperature Compensated Over -- 40"to +125"C
!Patented Silicon Shear Stress Strain Gauge
!Durable Epoxy Unibody Element
!Easy--to--Use Chip Carrier Option
Figure 1. Fully Integrated Pressure Sensor
Schematic
VS
SENSING
ELEMENT
GND
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
Vout
PINS 4, 5, AND 6 ARE NO CONNECTS FOR
UNIBODY DEVICE
PINS 1, 5, 6, 7, AND 8 ARE NO CONNECTS
FOR SMALL OUTLINE PACKAGE DEVICE
MPX5050
Rev. 7, 10/2004
Freescale Semiconductor
Technical Data
#Freescale Semiconductor, Inc., 2004. All rights reserved.
MPX5050
MPXV5050G
SERIES
INTEGRATED
PRESSURE SENSOR
0to50kPa(0to7.25psi)
0.2 to 4.7 Volts Output
PIN NUMBER
NOTE:Pins4,5,and6areinternal
device connections. Do not connect
to external circuitry or ground. Pin 1
is noted by the notch in the lead.
MPX5050D
CASE 867
MPX5050DP
CASE 867C
1
2
3
Vout
Gnd
VS
4
5
6
N/C
N/C
N/C
MPX5050GP
CASE 867B
UNIBODY PACKAGE
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV5050DP
CASE 1351
MPXV5050GP
CASE 1369
PIN NUMBER
1
2
3
N/C
VS
Gnd
5
6
7
N/C
N/C
N/C
4V
out 8N/C
NOTE:Pins1,5,6,7,and8are
internal device connections. Do not
connect to external circuitry or
ground. Pin 1 is noted by the notch
in the lead.
Freescale Semiconductor Preferred Device
2
Sensor Device Data
Freescale Semiconductor
MPX5050 MPXV5050G SERIES
MAXIMUM RATINGS(NOTE)
Parametrics Symbol Value Unit
Maximum Pressure (P1 > P2) Pmax 200 kPa
Storage Temperature Tstg -- 4 0 "to +125" "C
Operating Temperature TA-- 4 0 "to +125" "C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (VS=5.0Vdc,T
A=25"C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4
required to meet electrical specifications.)
Characteristic Symbol Min Typ Max Unit
Pressure Range(1) POP 0 — 50 kPa
Supply Voltage(2) VS4.75 5.0 5.25 Vdc
Supply Current Io—7.0 10.0 mAdc
Minimum Pressure Offset(3) (0 to 85"C)
@V
S=5.0Volts
Voff 0.088 0.20 0.313 Vdc
Full Scale Output(4) (0 to 85"C)
@V
S=5.0Volts
VFSO 4.587 4.70 4.813 Vdc
Full Scale Span(5) (0 to 85"C)
@V
S=5.0Volts
VFSS —4.50 —Vdc
Accuracy(6) — — — 2.5 %VFSS
Sensitivity V/P —90 —mV/kPa
Response Time(7) tR—1.0 —ms
Output Source Current at Full Scale Output Io+ — 0.1 —mAdc
Warm--Up Time(8) — — 20 —ms
Offset Stability(9) — — 0.5 —%VFSS
NOTES:
1. 1.0kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
!Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
!Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
!Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from
minimum or maximum rated pressure at 25"C.
!TcSpan: Output deviation over the temperature range of 0"to 85"C, relative to 25"C.
!TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0"to 85"C, relative
to 25"C.
!Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25"C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm--up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MECHANICAL CHARACTERISTICS
Characteristics Typ Unit
Weight, Basic Element (Case 867) 4.0 grams
Weight, Basic Element (Case 1369) 1.5 grams
MPX5050 MPXV5050G SERIES
3
Sensor Device Data
Freescale Semiconductor
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPX5050/MPXV5050G series pressure sensor oper-
ating characteristics, and internal reliability and qualification
tests are based on use of dry air as the pressure media. Me-
dia, other than dry air, may have adverse effects on sensor
performance and long--term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0"to
85"C using the decoupling circuit shown in Figure 4.The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.
Figure 2. Output versus Pressure Differential
MAX
DIFFERENTIAL PRESSURE (kPa)
5.0
4.0
3.0
2.0
05535150
OUTPUT (V)
4525
4.5
3.5
2.5
1.5
5
TRANSFER FUNCTION:
Vout =V
S*(0.018*P+0.04) $ERROR
VS=5.0Vdc
TEMP = 0 to 85"C
1.0
0.5
503010 4020
MIN
TYPICAL
Figure 3. Cross--Sectional Diagram
(Not to Scale)
FLUORO SILICONE
GEL DIE COAT
WIRE BOND
LEAD FRAME
DIE STAINLESS STEEL
METAL COVER
EPOXY
PLASTIC
CASE
DIFFERENTIAL/GAUGEELEMENT
DIE
BOND
P1
P2
Figure 4. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
1.0 mF
IPS
470 pF
OUTPUT
Vs
+5V
0.01 mFGND
Vout
4
Sensor Device Data
Freescale Semiconductor
MPX5050 MPXV5050G SERIES
Nominal Transfer Value: Vout =V
S(P x 0.018 + 0.04)
+/-- (Pressure Error x Temp. Factor x 0.018 x VS)
VS=5.0V$0.25 Vdc
Transfer Function
0.0
-- 4 0 -- 2 0 0 2 0 4 0 6 0 14012010080
Temperature Error Band
-- 4 0 3
0to85 1
+125 3
Temperature in "C
4.0
3.0
2.0
1.0
MPX5050/MPXV5050G Series
Temp Multiplier
Temperature
Error
Factor
NOTE: The Temperature Multiplier is a linear response from 0"to --40"C and from 85"to 125"C.
Pressure Error Band
Error Limits for Pressure
Pressure (in kPa)
3.0
2.0
1.0
-- 1 . 0
-- 2 . 0
-- 3 . 0
0.0
0 10 20304050 60
Pressure Error (kPa)
Pressure Error (Max)
0to50kPa $1.25 kPa
MPX5050 MPXV5050G SERIES
5
Sensor Device Data
Freescale Semiconductor
PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the
pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing fluo-
rosilicone gel which protects the die from harsh media. The
Freescale Semiconductor MPX pressure sensor is designed
to operate with positive differential pressure applied, P1 >
P2.
The Pressure (P1) side may be identified by using the
table below:
Part Number Case Type
Pressure (P1)
Side Identifier
MPX5050D 867 Stainless Steel Cap
MPX5050DP 867C Side with Part Marking
MPX5050GP 867B Side with Port Attached
MPXV5050GP 1369 Side with Port Attached
MPXV5050DP 1351 Side with Part Marking
ORDERING INFORMATION — UNIBODY PACKAGE (MPX5050 SERIES)
MPX Series
Device Type Options Case Type Order Number Device Marking
Basic Element Differential 867 MPX5050D MPX5050D
Ported Elements Differential Dual Ports 867C MPX5050DP MPX5050DP
Gauge 867B MPX5050GP MPX5050GP
ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV5050G SERIES)
Device Type Options Case No. MPX Series Order No. Packing Options Marking
Ported Elements Side Port 1369 MPXV5050GP Trays MPXV5050G
Dual Port 1351 MPXV5050DP Trays MPXV5050G
6
Sensor Device Data
Freescale Semiconductor
MPX5050 MPXV5050G SERIES
PACKAGE DIMENSIONS
UNIBODY PACKAGE
BASIC ELEMENT
CASE 867--08
ISSUE N
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
PIN 1
F
G
NL
R
C
B
M
J
S
NOTES:
10. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
11. CONTROLLING DIMENSION: INCH.
12. DIMENSION --A-- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
-- A --
123456
6PL
D
SEATING
PLANE -- T --
M
A
M
0.136 (0.005) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.595 0.630 15.11 16.00
B0.514 0.534 13.06 13.56
C0.200 0.220 5.08 5.59
D0.027 0.033 0.68 0.84
F0.048 0.064 1.22 1.63
G0.100 BSC 2.54 BSC
J0.014 0.016 0.36 0.40
L0.695 0.725 17.65 18.42
M30 NOM 30 NOM
N0.475 0.495 12.07 12.57
R0.430 0.450 10.92 11.43
S0.090 0.105 2.29 2.66
__
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. --VOUT
6. OPEN
STYLE 2:
PIN 1. OPEN
2. GROUND
3. --VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
POSITIVE PRESSURE
(P1)
PRESSURE SIDE PORTED (AP, GP)
CASE 867B--04
ISSUE F
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
SEATING PLANE
R
N
C
J
PIN 1
M
Q
M
0.25 T
B
6X D
G
F
S
K
V
S
P
M
0.173 Q S
T
L
U
A
1
234 5
6
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
DIM MIN MAX
MILLIMETERS
A29.08 29.85
B17.4 18.16
C7.75 8.26
D0.68 0.84
F1.22 1.63
G2.54 BSC
J0.36 0.41
K17.65 18.42
L7.37 7.62
N10.67 11.18
P3.89 4.04
Q3.89 4.04
R5.84 6.35
S5.59 6.1
U23.11 BSC
V4.62 4.93
T
P
P
Q
Q
MPX5050 MPXV5050G SERIES
7
Sensor Device Data
Freescale Semiconductor
PACKAGE DIMENSIONS--CONTINUED
UNIBODY PACKAGE
PRESSURE AND VACUUM SIDES PORTED (DP)
CASE 867C--05
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
R
X
123456
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A1.145 1.175 29.08 29.85
B0.685 0.715 17.40 18.16
C0.405 0.435 10.29 11.05
D0.027 0.033 0.68 0.84
F0.048 0.064 1.22 1.63
G0.100 BSC 2.54 BSC
J0.014 0.016 0.36 0.41
K0.695 0.725 17.65 18.42
L0.290 0.300 7.37 7.62
N0.420 0.440 10.67 11.18
P0.153 0.159 3.89 4.04
Q0.153 0.159 3.89 4.04
R0.063 0.083 1.60 2.11
S
U0.910 BSC 23.11 BSC
V0.182 0.194 4.62 4.93
W0.310 0.330 7.87 8.38
X0.248 0.278 6.30 7.06
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PORT #1
PIN 1
PORT #2
POSITIVE
VACUUM
PRESSURE
SEATING
PLANE
SEATING
PLANE -- T -- -- T --
P
G
C
J
N
B
F
D
W
V
L
U
6PL
S
K
-- Q --
-- A --
M
Q
M
0.25 (0.010) T
M
A
M
0.13 (0.005)
PRESSURE (P1)
0.220 0.240 5.59 6.10
(P1)
(P2)
8
Sensor Device Data
Freescale Semiconductor
MPX5050 MPXV5050G SERIES
SMALL OUTLINE PACKAGE DIMENSIONS
SURFACE MOUNT
CASE 1369--01
ISSUE O
D
E
e/2
N
e
A
M
0.004 (0.1) BC
A
E1
A
B
C
0.004 (0.1)
A0.008 (0.20) BC
8X b
2 PLACES 4 TIPS
DETAIL G
SEATING
PLANE
8X
P
1
4
8
5
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M--1994.
3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION ”b” DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.008 (0.203) MAXIMUM.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
0.300 0.330 7.11 7.62
INCHES
A1 0.002 0.010 0.05 0.25
b0.038 0.042 0.96 1.07
D0.465 0.485 11.81 12.32
E
E1 0.465 0.485 11.81 12.32
e
M0.270 0.290 6.86 7.36
N0.080 0.090 2.03 2.28
P0.009 0.011 0.23 0.28
T0.115 0.125 2.92 3.17
0.100 BSC 2.54 BSC
F0.245 0.255 6.22 6.47
K0.120 0.130 3.05 3.30
L0.061 0.071 1.55 1.80
F
K
M
GAGE
DETAIL G
LA1
%
.014 (0.35)
PLANE
0707
""""
%
T
&
0.717 BSC 18.21 BSC
MPX5050 MPXV5050G SERIES
9
Sensor Device Data
Freescale Semiconductor
SMALL OUTLINE PACKAGE DIMENSIONS -- CONTINUED
SURFACE MOUNT
CASE 1351--01
ISSUE O
D
E
e/2
N
e
A
M
0.004 (0.1) BC
A
E1
A
B
C
0.004 (0.1)
A0.006 (0.15) BC
8X b
2 PLACES 4 TIPS
DETAIL G
SEATING
PLANE
8X
P
1
4
8
5
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M--1994.
3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION ”b” DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.008 (0.203) MAXIMUM.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
0.370 0.390 9.39 9.91
INCHES
A1 0.002 0.010 0.05 0.25
b0.038 0.042 0.96 1.07
D0.465 0.485 11.81 12.32
E0.680 0.700 17.27 17.78
E1 0.465 0.485 11.81 12.32
e
M0.270 0.290 6.86 7.37
N0.160 0.180 4.06 4.57
P0.009 0.011 0.23 0.28
T0.110 0.130 2.79 3.30
0.100 BSC 2.54 BSC
F0.240 0.260 6.10 6.60
K0.115 0.135 2.92 3.43
L0.040 0.060 1.02 1.52
F
K
M
T
&
GAGE
DETAIL G
LA1
%
.014 (0.35)
PLANE
0707
""""
%
STYLE 1:
PIN 1. GND
2. +Vout
3. Vs
4. --Vout
5. N/C
6. N/C
7. N/C
8. N/C
STYLE 2:
PIN 1. N/C
2. Vs
3. GND
4. Vout
5. N/C
6. N/C
7. N/C
8. N/C
10
Sensor Device Data
Freescale Semiconductor
MPX5050 MPXV5050G SERIES
NOTES
MPX5050 MPXV5050G SERIES
11
Sensor Device Data
Freescale Semiconductor
NOTES
12
Sensor Device Data
Freescale Semiconductor
MPX5050 MPXV5050G SERIES
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MPX5050
Rev. 7
10/2004
